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Used ESEC 2008 SC Die Bonders in Malaysia

  • Trusted Seller
    ESEC 2008SC3 Plus

    ESEC 2008SC3 Plus

    • Manufacturer: ESEC
    • Model: 2008 SC

    ESEC 2008SC3 Plus Smart Card Die Bonder Ex-Works. Smart card die attach, handle up to 300mm wafer. Configuration of machine base on customer request.

    Malacca, Malaysia
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    ESEC 2008 SC Die Bonder

    • Manufacturer: ESEC
    • Model: 2008 SC

    Good condition ESEC 2008 SC Die Bonders manufactured in 2008. Located in Malaysia and other countries. Click request price for more information.

    Malaysia