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12

Used Assembly / Packaging (Semiconductors) in Tokyo, Japan

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    1998 DISCO DFD651

    • Manufacturer: Disco
    • Model: DFD651

    Manufacturing process: assembly | Inch: 4

    Tokyo, Japan
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    2002 DISCO DFD6360

    • Manufacturer: Disco
    • Model: DFD6360

    Manufacturing process: assembly | Inch: 350mm

    Tokyo, Japan
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    2006 DISCO DFD6361

    • Manufacturer: Disco
    • Model: DFD6361

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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    2009 DISCO DFD6340

    • Manufacturer: Disco
    • Model: DFD6340

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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    2017 DISCO DFD6340

    • Manufacturer: Disco
    • Model: DFD6340

    Manufacturing process: assembly | Inch: Square Substrate

    Tokyo, Japan
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    2003 DISCO DFD651

    • Manufacturer: Disco
    • Model: DFD651

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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    DISCO DFD641

    • Manufacturer: Disco
    • Model: DFD641

    Manufacturing process: assembly | Inch: 6

    Tokyo, Japan
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    2007 DISCO DFD6361

    • Manufacturer: Disco
    • Model: DFD6361

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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    1997 DISCO DFD640

    • Manufacturer: Disco
    • Model: DFD640

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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    2004 DISCO DAD3350

    • Manufacturer: Disco
    • Model: DAD3350

    Manufacturing process: assembly | Inch: 6

    Tokyo, Japan
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    2004 DISCO DAC552

    • Manufacturer: Disco
    • Model: DAC552

    Manufacturing process: assembly | Inch: 4

    Tokyo, Japan
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    2000 DISCO DAD522

    • Manufacturer: Disco
    • Model: DAD522

    Manufacturing process: assembly | Inch: 4,6

    Tokyo, Japan