Used Disco Semiconductors in China

DISCO DFG8540

• Manufacturer: Disco
• Model: DFG8540

Equipment name: Grinder thinning machine

DISCO GNX300

• Manufacturer: Disco

Okamoto gnx300 12 inch wafer back ultra-thin grinding and thinning equipment, with new color and high precision in 2005. The company has a professional service team to provide after-sales machine spare parts main...

2007 DISCO+SECRON EAD6340+SW5000

• Manufacturer: Disco
• Model: EAD6340

2004 DISCO DFG 850

• Manufacturer: Disco
• Model: DFG850

The Disco dfg850 8" back wafer grinding and thinning machine, compatible with 4-5-6" products. high efficiency.

DISCO DFG840HS

• Manufacturer: Disco
• Model: DFG840HS

2004 DISCO DFG860

• Manufacturer: Disco
• Model: DFG860

Disco dfg860 wafer ultra-thin grinding equipment, 3 disk rotatable design, high precision, good stability, high efficiency. Suitable for 12 inch wafer back grinding and thinning.

1998 DISCO DFG841

• Manufacturer: Disco
• Model: DFG841

MDHYDS12FA 12 inch discing saw for semiconductor industry

• Manufacturer: Minder Hightech

Application: IC，Optical Optoelectronics，Communications，LED package，QFN package，DFN package，BGA package | Material suitable: Silicon wafer, lithium niobate, ceramic, glass, quartz, alumina, PCB board

10W 20W 3D UV Laser Marking Machine with Rotary Disk for PCB Cable LED

Industrial design standard Working with the way of 7 days/24-hour Widely applied on industrial materials with very little heat affecting are Linxuan UV laser marking machine takes 355nm pumped purple light laser ...