- Trusted Seller
Disco DFG850 Fully Automatic Grinder
- Manufacturer: Disco
- Model: DFG850
Dimensions & weight estimates: Mainframe dim (cm): 120 x 260 x 180 Mainframe weight (kg): 1500 Bypack1 dim (cm): 50 x 110 x 190 Bypack1 weight (kg): 200 E-test area, possible Au-contamination
Europe - Trusted Seller
2004 Disco DFG850
- Manufacturer: Disco
- Model: DFG850
Spindle Type Air Bearings Maximum Spindle Speed Max 7,000 RPM External Cooling Water Cooled Condition Good Year of Manufacture 2004 Power Requirements 200-208 V 50/60 Hz 3 Phase
Europe - Trusted Seller
2000 Disco DFG 850
- Manufacturer: Disco
- Model: DFG850
Asia 
2004 DISCO DFG 850
- Manufacturer: Disco
- Model: DFG850
The Disco dfg850 8" back wafer grinding and thinning machine, compatible with 4-5-6" products. high efficiency.
Suzhou, China
Disco DFG850 Wafer Grinding
- Manufacturer: Disco
- Model: DFG850
Good condition Disco DFG850 Wafer Grinding manufactured in 2000. Located in USA and other countries. Click request price for more information.
Asia
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