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Used Disco DFD6361 Assembly / Packaging (Semiconductors)

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    DISCO HI-TEC AMERICA, INC. DFD6361HC/FC/ET

    • Manufacturer: Disco
    • Model: DFD6361

    Fully automatd 300mm DICING w/HC/FC/ET

    Yongin-si, South Korea
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    DISCO DFD6361

    • Manufacturer: Disco
    • Model: DFD6361

    Asia
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    Disco DFD6361

    • Manufacturer: Disco
    • Model: DFD6361

    - Wafer Size: 300 - Group: Electronic - Category: Semiconductor Assembly & Packaging - Family: Dicing Saws/Scribes - Type: Dicing Saw - Manufacturer: Disco

    Asia
  • 2009 DISCO DFD6361

    2009 DISCO DFD6361

    • Manufacturer: Disco
    • Model: DFD6361

    Enhanced dicing throughput The DFD6361 enhances throughput in two distinct ways.

    Suzhou, China
  • DISCO DFD6361

    DISCO DFD6361

    • Manufacturer: Disco
    • Model: DFD6361

    DICING SAW

    Taipei City, Taiwan
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    2006 DISCO DFD6361

    • Manufacturer: Disco
    • Model: DFD6361

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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    2007 DISCO DFD6361

    • Manufacturer: Disco
    • Model: DFD6361

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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    2007 DISCO DFD6361

    • Manufacturer: Disco
    • Model: DFD6361

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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    2006 DISCO DFD6361

    • Manufacturer: Disco
    • Model: DFD6361

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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