- Trusted Seller
2020 Disco DAD3231
- Manufacturer: Disco
- Model: DAD3231
Includes: -2.0 kW Non-Siezing Air Bearing Spindle -Alignment Vision System -Micro Microscope -Auto Alignment -Auto Focus -Auto Kerf Check -6-inch cutting area -GUI Touch Screen Operating System -LED Lighting
- Trusted Seller
2018 Disco DAD3240
- Manufacturer: Disco
- Model: DAD3240
-X-axis: -Y-axis: -Z-axis: -θ-axis: -Spindle: Machine type: Process Equipment | Machine location: Upon Request | Stock #: 442927 | -max. workpiece size: Φ8 inch / Square die 200mm | -cutting range: 210 mm | -cutt...
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2010 Disco DFL7160
- Manufacturer: Disco
- Model: DFL7160
Wafer Sizes:12"/300mm Used to cut SIC, currently configured as a 300mm system, should be able to be converted to 200mm with a new chuck. The DFL7160 is a fully automatic laser saw that is compatible with 300 mm...
United States - Trusted Seller

2011 Disco DAD3350
- Manufacturer: Disco
- Model: DAD3350
System is complete and there are no known issues with the unit. System comes with BBD/NCS/MAC&MIC scope. OEM Model Description Supports a wide range of applications DAD3350 is capable of handling a maximum of ...
United States - Trusted Seller

2009 Disco DFL 7160
- Manufacturer: Disco
- Model: DFL7160
Process Laser saw Vintage 2009 Wafer Size 8 inch ( Max Workpiece Size 12 inch) Voltage 200~240 VAC ± 10%, 3 Phase Equipment component Main body Main power Loadlock Laser type:A type No Chiller
ASIA 
Disco DAD561
- Manufacturer: Disco
- Model: DAD561
Application: Dicing for 6 inch | Classification: item | Work size: ø152.4 | X-axis: Useable stroke | Cut speed: 0.04~300.00 | Bearing type: Linear guide | Y-axis: Useable stroke | Indexing step range: 0.0001 to ...
South Korea
Disco DFD 2D/8
- Manufacturer: Disco
- Model: DFD2D/8
Application: Dicing/Cutting/Slotting various wafers | Classification: item | Work size: 200 x 200 | X-axis: Useable stroke | Cut speed: 0.13 ~ 300 | Y-axis: Useable stroke | Indexing step: 0.0002 | Position accu...
South Korea
Disco DAD 320
- Manufacturer: Disco
- Model: DAD320
Application: Dicing/Cutting/Slotting various wafers | Classification: item | Work size: 160 x 160 | X-axis: Useable stroke | Cut speed: 0.13 ~ 300 | Y-axis: Useable stroke | Indexing step: 0.0002 | Position accu...
South Korea
Disco DAD 560
- Manufacturer: Disco
- Model: DAD560
Application: Dicing/Cutting/Slotting various wafers | Classification: item | Work size: ø152.4 | X-axis: Useable stroke | Cut speed: 0.04~300.00 | Bearing type: Linear guide | Y-axis: Useable stroke | Indexing s...
South Korea
Disco DAD-2H/6T
- Manufacturer: Disco
- Model: DAD2H/6T
Application: Dicing/Cutting/Slotting various wafers | ◆ workpiece size: ø160.4 | X-axis: stroke | Cut speed: 0.04 300.0 | Guide and driving method: Air guide,DC servomotor drive,belt feed | Y-axis: Useable strok...
South Korea
Disco DFD-3D/8
- Manufacturer: Disco
- Model: DFD3D/8
Application: Dicing/Cutting/Slotting various wafers | Drive method: AC Servo Motor-Direct Drive | Minimum stroke: 652mm (25.7") (end to end) | Set-up cut stroke: 200mm(8.7") | Cut speed: 0.7~3000mm/sec (0.0028 t...
South Korea- Trusted Seller

2009 Disco DFL-7160
- Manufacturer: Disco
- Model: DFL7160
*That particular tool is set up with a UV laser for Glass and GaN (visible light) Process Laser saw Vintage 2009 Wafer Size 8 inch ( Max Workpiece Size 12 inch) Voltage 200~240 VAC ± 10%, 3 Phase Equipment c...
Asia 
Disco DAD 640
- Manufacturer: Disco
- Model: DAD640
Application: Dicing/Cutting/Slotting for 8 inch | Work size: 203.2 | X-axis: Useable stroke | Cut speed: 0.1 ~ 450 | Y-axis: Useable stroke | Indexing step: 0.0002 | Position accuracy (cumulative pitch): 0.002 ...
South Korea
Disco DAD381
- Manufacturer: Disco
- Model: DAD381
Application: Dicing for 12 inch | Axis/block: Item | Work size: 304.8 x 304.8 | X-axis: Useable stroke | Cut speed: 0.1 ~ 400 | Y-axis: Useable stroke | Indexing step: 0.0001 | Position accuracy (cumulative pitc...
South Korea- Trusted Seller

Disco DFD-3D/8 Fully Automatic Dicing Saw
- Manufacturer: Disco
- Model: DFD3D/8
Status: excellent Application: Dicing/Cutting/Slotting various wafers ◆ X - axis Section Drive Method: AC Servo Motor-ball Screw Minimum Stroke: 652mm (25.7") (end to end) Set-up Cut Stroke: 220mm (8.7") Cu...
Asia

