Semiconductors » Die Bonders

Search By Manufacturer

Search By Country

Building Filters

9

Used roller

  • Royce DE35 Pick and Place

    Royce DE35 Pick and Place System 65124

    • Manufacturer: Royce Instruments
    • Model: DE 35

    ROYCE DE35 Pick and Place System For picking die from sawn or scribed wafers mounted on adhesive film. Picks die as small as 6 mil sq. Pick and Place program storage. 110/240V, 50/60 Hz.

    Freehold Township, NJ
  • Trusted Seller
    Westbond 7200A

    Westbond 7200A

    • Manufacturer: West Bond

    Epoxy dispense and chip pickup tool are grouped into one tool assembly which is motor and cam driven to oscillate into use position. Machine senses either epoxy dispense or chip pickup through relative position o...

    Billerica, MA
  • Trusted Seller
    no-image_en.png

    Westbond 7200

    • Manufacturer: West Bond

    The Westbond 7200 is an epoxy die bonder. This is a small footprint version. (Email us for photo)

    Billerica, MA
  • Trusted Seller
    2011 Datacon 2200 evo

    2011 Datacon 2200 evo

    • Manufacturer: Datacon
    • Model: 2200 EVO

    https://khs-semi.com/de/datacon-2200-evo Drive System: Dynamic servo drives in X, Y, Z, and P axes Vision System: Datacon image processing system for edge, structure, pattern, and ink-dot recognition Illumina...

    Germany
  • Trusted Seller
    no-image_en.png

    CREATIVE TECHNOLOGY ETE0207

    • Manufacturer: Unknown

    CREATIVE TECHNOLOGY ETE0207 UPPER ELECTRODE SMALL GDP 30 day parts warranty on all new parts. Available 2017

    Bree, Ireland
  • Submicron Semi-Auto Eutectic Die Bonder

    Submicron Semi-Auto Eutectic Die Bonder with table

      Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

      Guangzhou, China
    • Submicron Semi-Auto Eutectic Die Bonder

      Submicron Semi-Auto Eutectic Die Bonder RYW-ETB05B

        Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

        Guangzhou, China
      • Submicron Manual Rotary Die Bonder

        Submicron Manual Rotary Die Bonder RYW-ETB05

          Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

          Guangzhou, China
        • Submicron Manual Rotary Die Bonder

          Submicron Manual Rotary Die Bonder RYW-ETB05S

            Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

            Guangzhou, China

          Overview

          Bonders are specialized machines used to bond materials together, commonly employed in the semiconductor and electronics industries. They utilize various techniques like thermal, ultrasonic, or adhesive bonding to ensure precise and reliable connections between components, making them essential for manufacturing and assembly processes.

          FAQ

          What factors should I consider when purchasing a used bonder?

          Consider the machine's bonding technology, age, condition, and compatibility with your materials. Verify maintenance records and inspect for any signs of wear or damage.

          How can I ensure safe shipping for a bonder?

          Choose a reputable shipping company experienced in handling delicate machinery. Ensure the bonder is properly packed and secured to prevent damage during transit.

          What is the maintenance routine for a bonder?

          Regular maintenance includes cleaning bonding surfaces, checking for wear on critical components, and calibrating the machine. Follow the manufacturer’s maintenance schedule for optimal performance.