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ASM 802-00206/H asm die bonder part PCB 03-21817-04/A IOM2 controller
5 in stock Experience precision and reliability with the ASM 802-00206/H die bonder, an essential tool for advanced semiconductor manufacturing. Designed for high-quality bondings, this equipment is a testament t...
$625 USDNew York, USA - Trusted Seller

Dage Precision 2400PC
- Manufacturer: Nordson DAGE
Dage Precision 2400PC Dage 2400 PC Assembly Test Tool Wire Pull/Ball Shear/Die Shear Tester
Bree, Ireland - Trusted Seller

2011 Datacon 2200 evo
- Manufacturer: Datacon
- Model: 2200 EVO
https://khs-semi.com/de/datacon-2200-evo Drive System: Dynamic servo drives in X, Y, Z, and P axes Vision System: Datacon image processing system for edge, structure, pattern, and ink-dot recognition Illumina...
Germany 
FC300: The High Force and High Accuracy Die Bonder for Large Devices
The FC300 High Precision Die / Flip Chip Bonder is the newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm. The tool features automated hand...
Singapore
