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Used controller in China

MDAX-FC810 flip chip die bonder
MDAX-FC810 flip chip die bonder This model is a fixed crystal mount machine designed specifically for high-precision optical modules, optical devices, sensors, and various high-precision IC packaging flip chips A...
Guangzhou, China
MDDB-LA838 Die attach
- Manufacturer: Minder Hightech
Equipment specifications Control specifications
Guangzhou, China
Manual Epoxy and Eutectic Die Bonder
MDSJHYZPGJ0225 Epoxy and Eutectic Die Bonder 1. Effective solution without touching the surface of the chip Clamp edge collapse problem 2. Automatic scribing, dispensing, sticking, automatic rebound height detec...
Guangzhou, China
ASM AD830
- Manufacturer: ASM
- Model: AD830
This manual is to provide trained engineer or technician with the AD830 die bonder interediate setup and servicing instruction. includes: ●Bond quality problem and solution, grease information and setup tools use...
Suzhou, China
Submicron Semi-Auto Eutectic Die Bonder with table
Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...
Guangzhou, China
Submicron Semi-Auto Eutectic Die Bonder RYW-ETB05B
Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...
Guangzhou, China
Submicron Manual Rotary Die Bonder RYW-ETB05
Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...
Guangzhou, China
Submicron Manual Rotary Die Bonder RYW-ETB05S
Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...
Guangzhou, China
MD-DDM08 die demounter
- Manufacturer: Minder Hightech
Product features： 1. Suitable for wafer peeling process of 8 inches and below; 2. Adopting non-contact film stripping to prevent damage to grains and improve product qualification rate; 3. Simple and convenient o...
Guangzhou, China

Overview

Bonders are specialized machines used to bond materials together, commonly employed in the semiconductor and electronics industries. They utilize various techniques like thermal, ultrasonic, or adhesive bonding to ensure precise and reliable connections between components, making them essential for manufacturing and assembly processes.

FAQ

What factors should I consider when purchasing a used bonder?

Consider the machine's bonding technology, age, condition, and compatibility with your materials. Verify maintenance records and inspect for any signs of wear or damage.

How can I ensure safe shipping for a bonder?

Choose a reputable shipping company experienced in handling delicate machinery. Ensure the bonder is properly packed and secured to prevent damage during transit.

What is the maintenance routine for a bonder?

Regular maintenance includes cleaning bonding surfaces, checking for wear on critical components, and calibrating the machine. Follow the manufacturer’s maintenance schedule for optimal performance.