HGTECH LUSD3310 Fully Automatic SiC Wafer Modification and Cutting Equipment
new
- Manufacturer: Hgtech
The Fully Automatic SiC Wafer Modification and Cutting Equipment LUSD3310 uses multiple high-precision CCD vision cameras to automatically identify and locate 6-8 inch wafers with various die specifications. Comb...
Wuhan, China
YBDX160 Diamond Multi-wire Saw
new
- Manufacturer: Beijing Sinopoly Technology
Model.160 is mainly used for highly speeding and highly precisely slicing 2" , 4" ,6" sapphire ingot in mass prodution. The equipment can achieve a very good stable performance featured with low noise, low vibrat...
Beijing, China
DX485C Multi-wire Saw
new
- Manufacturer: Beijing Sinopoly Technology
Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...
Beijing, China
DX2231HC Multi-wire Saw
new
- Manufacturer: Beijing Sinopoly Technology
Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...
Beijing, China
HGTECH Wafer Slotting Series Wafer Laser Slotting Equipment
new
- Manufacturer: Hgtech
Product advantages: Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position Based on spatial light mo...
Wuhan, China
HGTECH Laser Scribing Series Nanosecond Laser Scribing Equipment
new
- Manufacturer: Hgtech
Product advantages: The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ 30 ± 5 μm) , small edge collapse ≤ 10 μm UPH ≥ 15 (take 40mil, 5-inch GPP wafer as an example, includ...
Wuhan, China
Semi automatic wafer expander
new
- Manufacturer: Minder Hightech
Semi automatic film cutting and expanding machine chip packaging semi automatic crystal expanding machine 6 inch 8 inch 10 inch 12 inch film expanding equipment 1、 Introduction: Wafer expander is also called wafe...
Guangzhou, China
6inch Dicing saw for semiconductor industry
new
- Manufacturer: Minder Hightech
Application: IC,Optical,communication,LED,MEMS,Medical,NTC,Quartz,Diode,Triode etc. | Material suitable: Si,GaAsLiNbO3,Al2O3,Ceramic,Glass,Quartz,PCB,EMC etc.
Guangzhou, China
MDHYDS12FA 12 inch discing saw for semiconductor industry
new
- Manufacturer: Minder Hightech
Application: IC，Optical Optoelectronics，Communications，LED package，QFN package，DFN package，BGA package | Material suitable: Silicon wafer, lithium niobate, ceramic, glass, quartz, alumina, PCB board
Guangzhou, China
Tip: Enter manufacturer, model or keyword