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3

Used parallel in Malaysia

  • Module-Level Burn-in

    Module-Level Burn-in

      Input/ output options: JEDEC Tray | Selection of packages: Silicon Carbide (SiC), Gallium Nitride (GaN) Power devices | Channel number: Up to 720 power device burn-in test parallelism | Burn-in duration: Program...

      Penang, Malaysia
    • no-image_en.png

      Wafer-Level Burn-in

        Chuck quantity: Octa Chuck | Package type: Silicon Carbide (SiC) Power Device | Wafer size: 6, 8 inch | Input/ output option: Wafer Cassette (Up to 2 cassettes) | Die per wafer burn-in parallelism: 4000 | Total ...

        Penang, Malaysia
      • no-image_en.png

        Discrete-Level Test

          Input options: Vibrator Bowl, Plastic Tube Stacker | Output options: Tape & Reel, Plastic Tube Stacker | Test capabilities: Electrical Functional Test, Open Short Test, Insulation test | Test site: Dual Test Sit...

          Penang, Malaysia