Module-Level Burn-in
Input/ output options: JEDEC Tray | Selection of packages: Silicon Carbide (SiC), Gallium Nitride (GaN) Power devices | Channel number: Up to 720 power device burn-in test parallelism | Burn-in duration: Program...
Penang, Malaysia
Wafer-Level Burn-in
Chuck quantity: Octa Chuck | Package type: Silicon Carbide (SiC) Power Device | Wafer size: 6, 8 inch | Input/ output option: Wafer Cassette (Up to 2 cassettes) | Die per wafer burn-in parallelism: 4000 | Total ...
Penang, Malaysia
Discrete-Level Test
Input options: Vibrator Bowl, Plastic Tube Stacker | Output options: Tape & Reel, Plastic Tube Stacker | Test capabilities: Electrical Functional Test, Open Short Test, Insulation test | Test site: Dual Test Sit...
Penang, Malaysia

