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Used Wafer Grinding

  • Trusted Seller
    2012 DISCO DAG810

    2012 DISCO DAG810

    • Manufacturer: Disco
    • Model: DAG810

    De-installed, Warehoused, Can be inspected Wafer size: 200MM

    Seoul, South Korea
  • Trusted Seller
    2014 DISCO DFG8540

    2014 DISCO DFG8540

    • Manufacturer: Disco
    • Model: DFG8540

    De-installed, Warehoused, Can be inspected Wafer size: 200MM

    Seoul, South Korea
  • Trusted Seller
    SSAUL BESTECH BESTPOL P202

    SSAUL BESTECH BESTPOL P202

    • Manufacturer: BESTECH

    De-installed, Warehoused, Can be inspected

    Seoul, South Korea
  • Trusted Seller
    1994 Okamoto VG 502 MK

    1994 Okamoto VG 502 MK II

    • Manufacturer: Okamoto
    • Model: VG-502

    Working condition This machine has been 8 inches installed

    Asia
  • DS Precision Ind. Co. DS-Precision

    DS Precision Ind. Co. DS-Precision

    • Manufacturer: DS Precision Ind. Co.

    Application: Lapping/Polishing various wafers | - table motion: Rotational Motion | - stable repeatability: less than 5% | - work clamp: Rotation Guide | - workpiece: Max 6" | - table size: 380mm | - slurry spra...

    South Korea
  • Trusted Seller
    TOOL AND CUTTER GRINDER, LIZZINI

    TOOL AND CUTTER GRINDER, LIZZINI (Italy) - NO. 3

    • Manufacturer: Lizzini
    • Model: NO 3

    TOOL AND CUTTER GRINDER Make : LIZZINI.
 Mod. : NO. 3 THE MACHINE IS EQUIPPED WITH MAGNET PLATE.
 Centre height : 140 mm. Machine approx. weight : 1100 Kg. Overall dimensions: Length : 1800 mm. Width : 1200 mm. H...

    India
  • Trusted Seller
    INTERNAL GRINDER, OMECA MATIC (Italy)

    INTERNAL GRINDER, OMECA MATIC (Italy) - 500 mm

    • Manufacturer: OMECA MATIC (Italy)

    INTERNAL GRINDER Make : OMECA MATIC (Italy) Swing over table : 500 mm. Max. Grinding length : 500 mm. Max. Bore length : 300 mm. Max. Bore diameter : 200 mm. Spindle speed : 16.000 r.p.m. HYDRAULIC CLAMPING AUTO ...

    India
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    2010 Fritsch Japan SCAN-DIA

    • Manufacturer: Fritsch

    Wafer polishing machine (like new)

    Yongin-si, South Korea
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    DISCO DFG-840

    • Manufacturer: Disco

    Back Grinder Wafer size: 200mm

    Yongin-si, South Korea
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    Front End Equipment

    • Manufacturer: TiSi

    testing / manual grind machine Wafer size: 200mm

    Yongin-si, South Korea
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    FEI Gatan 656

    • Manufacturer: FEI

    Non-fab / [P01A0799][1QTEM01_1] Gatan 656 Dimple grinder.

    Yongin-si, South Korea
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    OKAMOTO SVG-502MK

    • Manufacturer: Okamoto
    • Model: SVG-502

    THINNING Wafer size: 4

    Yongin-si, South Korea
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    DISCO DFG8140

    • Manufacturer: Disco

    Back side polisher DFG8140 Wafer size: 8"

    Yongin-si, South Korea
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    DISCO DFG8140

    • Manufacturer: Disco

    Back side polisher DFG8140

    Yongin-si, South Korea
  • Manual for Used Okamoto Mold

    Manual for Used Okamoto Mold & Dia Form Gringing Machine KSK-Z2 (Fanuc OMA) – Programming Manual

    • Manufacturer: Okamoto
    • Model: KSK-Z2

    Manual Available :– Programming Manual *We only charge administrative fee for processing the manuals. PDF manuals will be emailed upon receiving payment. Kindly check your Spam/Junk folder if you did not receive...

    $70 USD
    Singapore
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    Okamoto ASM-100A Wafer Grinding

    • Manufacturer: Okamoto
    • Model: ASM-100A

    Good condition Okamoto ASM-100A Wafer Grinding. Located in Ireland and other countries. Click request price for more information.

    Ireland
1011121314