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Used Assembly / Packaging (Semiconductors) in Tokyo, Japan

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    2019 OKUHARA MR-250

    • Manufacturer: OKUHARA

    Manufacturing process: assembly

    Tokyo, Japan
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    NOMURA MICRO SCIENCE N4C-3.0-120

    • Manufacturer: Nomura Micro Science

    Manufacturing process: assembly

    Tokyo, Japan
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    2017 PANASONIC SPV(NM-EJP7A)

    • Manufacturer: Panasonic

    Manufacturing process: assembly

    Tokyo, Japan
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    2011 TAMURA TNX25-307EM

    • Manufacturer: TAMURA

    Manufacturing process: assembly

    Tokyo, Japan
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    2014 LINTEC RAD-3510F12

    • Manufacturer: Lintec
    • Model: RAD-3510F12

    Manufacturing process: assembly | Inch: 8,12

    Tokyo, Japan
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    2003 DISCO DFD651

    • Manufacturer: Disco
    • Model: DFD651

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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    DISCO DFD641

    • Manufacturer: Disco
    • Model: DFD641

    Manufacturing process: assembly | Inch: 6

    Tokyo, Japan
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    2017 DISCO DFD6340

    • Manufacturer: Disco
    • Model: DFD6340

    Manufacturing process: assembly | Inch: Square Substrate

    Tokyo, Japan
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    2005 MINAMI MK-880SV

    • Manufacturer: MINAMI

    Manufacturing process: assembly | Inch: Substrate M size

    Tokyo, Japan
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    2018 OKUHARA MR-250M

    • Manufacturer: OKUHARA

    Manufacturing process: assembly

    Tokyo, Japan
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    OTSUKA HH41-0762-1

    • Manufacturer: OTSUKA

    Manufacturing process: assembly

    Tokyo, Japan
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    2005 KYOWARIKEN &SMZ800

    • Manufacturer: KYOWARIKEN

    Manufacturing process: assembly

    Tokyo, Japan
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    SAMCO PXA-100KM

    • Manufacturer: Samco

    Manufacturing process: assembly

    Tokyo, Japan
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    PANASONIC PC30B-HS

    • Manufacturer: Panasonic
    • Model: PC30B-HS

    Manufacturing process: assembly

    Tokyo, Japan
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    2015 MUSASHI TAD1000

    • Manufacturer: Musashi

    Manufacturing process: assembly

    Tokyo, Japan
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