Used Assembly / Packaging (Semiconductors) in Saitama, Japan

DISCO DFD640

• Manufacturer: Disco
• Model: DFD640

Capable of dicing wafers up to 8 inches. This fully automatic dicing machine can automatically remove a frame with a maximum 8-inch wafer mounted from the cassette, transfer it to the chuck table This fully autom...

DISCO DFD651

• Manufacturer: Disco
• Model: DFD651

Equipped with dual spindles for dicing of up to 8-inch wafers.

DISCO DFD641

• Manufacturer: Disco
• Model: DFD641

Capable of dicing wafers up to 8 inches. This fully automatic dicing machine can automatically remove a frame with a maximum 8-inch wafer mounted from the cassette, transfer it to the chuck table This fully autom...

DISCO DAD340

• Manufacturer: Disco
• Model: DAD340

DISCO DFD6750

• Manufacturer: Disco
• Model: DFD6750

DISCO DFD6361

• Manufacturer: Disco
• Model: DFD6361

Fully automatic dicing machine for 12-inch

Disco DAD3240

• Manufacturer: Disco
• Model: DAD3240

Dicing saw

Disco DFD6340

• Manufacturer: Disco
• Model: DFD6340

Disco DFD6340

• Manufacturer: Disco
• Model: DFD6340

Fully automatic dicing machine

DISCO DAD3350

• Manufacturer: Disco
• Model: DAD3350

Automatic dicing machine for 8-inch 2.2kw spindle single spindle Equipped with LCD touch panel and GUI

DISCO DAD3221

• Manufacturer: Disco
• Model: DAD3221

Automatic dicing machine for 6-inch

DISCO DFD650

• Manufacturer: Disco
• Model: DFD650

Equipped with dual spindles for dicing of up to 8-inch wafers.

DISCO DFD651

• Manufacturer: Disco
• Model: DFD651

Equipped with dual spindles for dicing of up to 8-inch wafers.

DISCO DAD562

• Manufacturer: Disco
• Model: DAD562

DISCO DAD3350

• Manufacturer: Disco
• Model: DAD3350

Automatic dicing machine for 8-inch 2.2kw spindle single spindle Equipped with LCD touch panel and GUI