Used Wafer Slicing / Dicing in China

2009 LINTEC RAD3510

• Manufacturer: Lintec

Equipment name: WAFER MOUTER

NITTO MA1508N

• Manufacturer: Nitto
• Model: MA1508N

Equipment name: WAFER MOUTER

2003 NITTO MA-3000Ⅱ

• Manufacturer: Nitto

Equipment name: WAFER MOUTER

DISCO DFG840HS

• Manufacturer: Disco
• Model: DFG840HS

Semi automatic wafer expander

• Manufacturer: Minder Hightech

Semi automatic film cutting and expanding machine chip packaging semi automatic crystal expanding machine 6 inch 8 inch 10 inch 12 inch film expanding equipment 1、 Introduction: Wafer expander is also called wafe...

MDHYDS12FA 12 inch discing saw for semiconductor industry

• Manufacturer: Minder Hightech

Application: IC，Optical Optoelectronics，Communications，LED package，QFN package，DFN package，BGA package | Material suitable: Silicon wafer, lithium niobate, ceramic, glass, quartz, alumina, PCB board

ACCRETECH AD20T/S

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: AD20T

Revolutionary axis design orientation creates the smallest twin spindle Dicing Saw Dicing Saw nFoot print The world's smallest footprint Footprint reduced 40% compared with Accretech's existing machines nHigh Thr...

6inch Dicing saw for semiconductor industry

• Manufacturer: Minder Hightech

Application: IC,Optical,communication,LED,MEMS,Medical,NTC,Quartz,Diode,Triode etc. | Material suitable: Si,GaAsLiNbO3,Al2O3,Ceramic,Glass,Quartz,PCB,EMC etc.