Used Wafer Slicing / Dicing

TSK A-WD-100A Dicing Saw Wafer Dicing Machine

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: A-WD-100A

TSK A-WD-200T Dicing Saw Wafer Saw 8" Wafer Dicing Machine Scribing Machine

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: A-WD-200T

TSK A-WD-300T Dicing Saw Wafer Saw Wafer Dicing Machine Scribing Machine 12 inches

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: A-WD-300T

DX485C Multi-wire Saw

• Manufacturer: Beijing Sinopoly Technology

Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...

YBDX160 Diamond Multi-wire Saw

• Manufacturer: Beijing Sinopoly Technology

Model.160 is mainly used for highly speeding and highly precisely slicing 2" , 4" ,6" sapphire ingot in mass prodution. The equipment can achieve a very good stable performance featured with low noise, low vibrat...

DX2231HC Multi-wire Saw

• Manufacturer: Beijing Sinopoly Technology

Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...

Teikoku Wafer detaping machine EXR-1200 F2 Tape Remover

• Manufacturer: Teikoku

HGTECH Wafer Slotting Series Wafer Laser Slotting Equipment

• Manufacturer: Hgtech

Product advantages: Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position Based on spatial light mo...

ACCRETECH SS30

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: SS30

12-inch dicing machine Small footprint with highly stable structure. Compliant with varieties of work Feature1 nFootprint Small footprint with highly stable structure nCompliant with varieties of work ・300mm wafe...

ACCRETECH SS10

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: SS10

Fastest and smallest 6-inch dicing machine. Improved operability with the 17-inch touch panel screen. The image-processing engine accommodates variety of work. Feature1 Fastest and smallest 6-inch dicing machine ...

ACCRETECH ML300Plus ⅡWH

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: ML300Plus-WH

12-inch laser dicing machine with wafer handling system. We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing The dicing machine is equ...

ACCRETECH AD3000T/S

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: AD3000T

Tokyo Seimitsu Dicing Machine realizes the remarkable "CoO (Cost of Ownership)" by the world smallest footprint, high throughput, and high processing quality reinforced by the collaboration of the up-to-date tech...

ACCRETECH SS20

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: SS20

8-inch dicing machine Small footprint with highly stable structure. Compliant with the large work Feature1 nFootprint Small footprint with highly stable structure nCompliant with large wafers 250mm square work si...

ACCRETECH ML200Plus FH

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: ML200Plus

8-inch laser dicing machine with dicing frame handling system. We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing engine, exhibiting ...

ACCRETECH AD20T/S

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: AD20T

Revolutionary axis design orientation creates the smallest twin spindle Dicing Saw Dicing Saw nFoot print The world's smallest footprint Footprint reduced 40% compared with Accretech's existing machines nHigh Thr...