IVG-2040/3040
Fully automatic single-axis thinning machine is suitable for 4-12 inches wafer grinding, equipped with robot up and down, and integrated with automatic centering, cleaning and drying functions, equipped with auto...
Beijing, China
TFG-3250
This equipment is a 3-spindle, 4-station automatic thinning machine for 6/8-inch wafer grinding, with high-precision spindles, equipped with robotic loading and unloading, integrated with auto-centering, transfer...
Beijing, China
TFG-2200/3200 series
This equipment is a dual spindle three-station automatic thinning machine for 6/8-inch wafer grinding, with high-precision spindles, equipped with robotic loading and unloading, integrated with automatic centerin...
Beijing, China
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