New Wafer Slicing / Dicing in China

HGTECH LUSD3310 Fully Automatic SiC Wafer Modification and Cutting Equipment

• Manufacturer: Hgtech

The Fully Automatic SiC Wafer Modification and Cutting Equipment LUSD3310 uses multiple high-precision CCD vision cameras to automatically identify and locate 6-8 inch wafers with various die specifications. Comb...

DX485C Multi-wire Saw

• Manufacturer: Beijing Sinopoly Technology

Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...

YBDX160 Diamond Multi-wire Saw

• Manufacturer: Beijing Sinopoly Technology

Model.160 is mainly used for highly speeding and highly precisely slicing 2" , 4" ,6" sapphire ingot in mass prodution. The equipment can achieve a very good stable performance featured with low noise, low vibrat...

DX2231HC Multi-wire Saw

• Manufacturer: Beijing Sinopoly Technology

Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...

HGTECH Wafer Slotting Series Wafer Laser Slotting Equipment

• Manufacturer: Hgtech

Product advantages: Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position Based on spatial light mo...

Universal AI 51208502 Cutter

• Manufacturer: Yinuo

1019822-250 MPM BLADE 250mm

• Manufacturer: Yinuo

1019822-450 MPM BLADE 450mm

• Manufacturer: Yinuo

1017192-300 MPM BLADE 300mm

• Manufacturer: Yinuo

1019822-350 MPM BLADE 350mm

• Manufacturer: Yinuo

HGTECH Laser Scribing Series Nanosecond Laser Scribing Equipment

• Manufacturer: Hgtech

Product advantages: The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ 30 ± 5 μm) , small edge collapse ≤ 10 μm UPH ≥ 15 (take 40mil, 5-inch GPP wafer as an example, includ...

6inch Dicing saw for semiconductor industry

• Manufacturer: Minder Hightech

Application: IC,Optical,communication,LED,MEMS,Medical,NTC,Quartz,Diode,Triode etc. | Material suitable: Si,GaAsLiNbO3,Al2O3,Ceramic,Glass,Quartz,PCB,EMC etc.

Semi automatic wafer expander

• Manufacturer: Minder Hightech

Semi automatic film cutting and expanding machine chip packaging semi automatic crystal expanding machine 6 inch 8 inch 10 inch 12 inch film expanding equipment 1、 Introduction: Wafer expander is also called wafe...

MDHYDS12FA 12 inch discing saw for semiconductor industry

• Manufacturer: Minder Hightech

Application: IC，Optical Optoelectronics，Communications，LED package，QFN package，DFN package，BGA package | Material suitable: Silicon wafer, lithium niobate, ceramic, glass, quartz, alumina, PCB board