SingaporeFC300: The High Force and High Accuracy Die Bonder for Large Devices
The FC300 High Precision Die / Flip Chip Bonder is the newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm. The tool features automated hand...
SingaporeACCµRA Plus: Dedicated to production for Optoelectronic and Silicon photonics applications
The ACCµRA Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes. ACCμRA Plus combines high precision, flexibility and short c...
Singapore
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