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Used Assembly / Packaging (Semiconductors)

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    2006 YAMATO DE610U

    • Manufacturer: Yamato
    • Model: DE610U

    Manufacturing process: assembly

    Tokyo, Japan
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    2015 MUSASHI TAD1000

    • Manufacturer: Musashi

    Manufacturing process: assembly

    Tokyo, Japan
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    DAGE DAGE-4000PXY

    • Manufacturer: Nordson DAGE

    Manufacturing process: assembly

    Tokyo, Japan
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    2007 DAGE DAGE-4000PXY

    • Manufacturer: Nordson DAGE

    Manufacturing process: assembly

    Tokyo, Japan
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    2016 SHIBUYA DB258

    • Manufacturer: SHIBUYA

    Manufacturing process: assembly

    Tokyo, Japan
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    2019 DAITRON WJS-200C

    • Manufacturer: DAITRON

    Manufacturing process: assembly | Inch: 6

    Tokyo, Japan
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    2014 LINTEC RAD-3510F12

    • Manufacturer: Lintec
    • Model: RAD-3510F12

    Manufacturing process: assembly | Inch: 8,12

    Tokyo, Japan
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    2008 TSK A-WD-10B

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK

    Manufacturing process: assembly | Inch: 6

    Tokyo, Japan
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    DISCO DFD641

    • Manufacturer: Disco
    • Model: DFD641

    Manufacturing process: assembly | Inch: 6

    Tokyo, Japan
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    1997 DISCO DFD640

    • Manufacturer: Disco
    • Model: DFD640

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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    2005 MINAMI MK-880SV

    • Manufacturer: MINAMI

    Manufacturing process: assembly | Inch: Substrate M size

    Tokyo, Japan
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