Semiconductors » Wafer Slicing / Dicing » Kyoto

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Used Wafer Slicing / Dicing in Kyoto, Japan

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    LGR-Series

    • Manufacturer: TOWA JAPAN

    Enables high-precision blade cutting of lead-less device products such as QFN packages. Selectable blade cut(FMS3040-HC) or laser cut(LGR1040) depending on process and lead frame design. Combining dedicated lead ...

    Kyoto, Japan